DocumentCode :
3408249
Title :
Initiating and Institutionalizing Software Product Line Engineering: From Bottom-Up Approach to Top-Down Practice
Author :
Li, Dong ; Chang, Carl K.
Author_Institution :
Dept. of Comput. Sci., Iowa State Univ., Ames, IA, USA
Volume :
1
fYear :
2009
fDate :
20-24 July 2009
Firstpage :
53
Lastpage :
60
Abstract :
A software-intensive company generally grows from one of its remarkable software products. Different approaches adopted by a company will contribute to its future evolution. The approach employed by FISCAN, a leading manufacturer of security inspection system in China, is software product line engineering (SPLE). This paper reviews the initiation and institutionalization of SPLE by FISCAN. This is a process started with a bottom-up approach from application engineering to domain engineering, and realized by a top-down practice from domain engineering back to application engineering. Eventually, a closed loop which connects domain engineering and application engineering is ready to accelerate core asset development and product development continuously. This paper offers a roadmap for the initiation and institutionalization of SPLE as it was developed at FISCAN, including establishing a core team of product line champions, formalizing matrix product line model (MPLM), developing core asset library and product lines and creating compatible process model.
Keywords :
product development; software development management; software libraries; software reusability; application engineering; asset development; asset library; bottom-up approach; closed loop; domain engineering; matrix product line model; product development; software product line engineering; software-intensive company; top-down practice; Airports; Application software; Computer applications; Computer industry; Hardware; Inspection; Manufacturing; Security; Software engineering; Software systems;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Computer Software and Applications Conference, 2009. COMPSAC '09. 33rd Annual IEEE International
Conference_Location :
Seattle, WA
ISSN :
0730-3157
Print_ISBN :
978-0-7695-3726-9
Type :
conf
DOI :
10.1109/COMPSAC.2009.17
Filename :
5254280
Link To Document :
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