Title :
Inductive-coupling interfaces for high-speed low-power proximity communications
Author :
Hayun Chung ; Kuroda, Tadahiro
Author_Institution :
Dept. of Electron. & Electr. Eng., Keio Univ., Yokohama, Japan
Abstract :
Inductive-coupling interfaces provide high-speed, low-power and cost-efficient solutions in proximity communications. Synchronous pulse-based inductive-coupling transceivers have been applied to a wide range of applications, such as through-chip interface, non-contact memory and wafer-level testing.
Keywords :
low-power electronics; three-dimensional integrated circuits; transceivers; wafer-scale integration; high-speed low-power proximity communications; inductive-coupling interfaces; non-contact memory; synchronous pulse-based inductive-coupling transceivers; through-chip interface; wafer-level testing; Testing;
Conference_Titel :
Circuits and Systems (MWSCAS), 2011 IEEE 54th International Midwest Symposium on
Conference_Location :
Seoul
Print_ISBN :
978-1-61284-856-3
Electronic_ISBN :
1548-3746
DOI :
10.1109/MWSCAS.2011.6026621
