Title :
Coupled 3D electromagnetic, structural, and thermal finite element analysis as integral components of electronic product design
Author :
Brauer, John R. ; Wallen, Patrick
Author_Institution :
Ansoft Corp., Milwaukee, WI, USA
Abstract :
Electronic product design is aided by coupled electromagnetic, structural, and thermal finite element analysis. Coupled electromagnetic and structural finite elements can predict motion vs. time in relays and in microelectromechanical systems (MEMS). Coupled electromagnetic and thermal finite elements can predict the temperature distributions in electronic packages
Keywords :
design engineering; finite element analysis; micromechanical devices; packaging; relays; thermal analysis; 3D finite element analysis; electromagnetic analysis; electronic package; electronic product design; microelectromechanical system; relay; structural analysis; temperature distribution; thermal analysis; Actuators; Electromagnetic analysis; Electromagnetic coupling; Electromagnetic fields; Electronic packaging thermal management; Finite element methods; Integral equations; Magnetic losses; Nonlinear equations; Product design;
Conference_Titel :
WESCON/96
Conference_Location :
Anaheim, CA
Print_ISBN :
0-7803-3274-1
DOI :
10.1109/WESCON.1996.554014
