A multi-antenna 60GHz CMOS transmitter using wire-bond antenna for high output power

Author

Tae Wook Kim ; Sanghoon Jung

Author_Institution

Sch. of Electr. & Electron. Eng., Yonsei Univ., Seoul, South Korea

fYear

2011

fDate

7-10 Aug. 2011

Firstpage

1

Lastpage

4

Abstract

A high output power CMOS transmitter is proposed for 60GHz communication system. In order to obtain high output power in millimeter wave frequency range, many PAs (Power Amplifier) with antennas are integrated in a single transmitter. The total output power (P_tot) of Multi (N) PAs with antenna which is spaced within wavelength is equivalent to the summation of output power (P_out) of each PA with antenna; P_tot (dB)=P_out(dB) +10logN. For the chip scale integration of a PA with antenna, a wire-bond can be used in high frequency range where wavelength/4 is less than chip size. Dipole style wire bond antenna is used for the proposed transmitter of multi-PA with antenna. 4 PAs with antenna is designed. Antenna gain of the bond wire antenna is -1.74dBi. Simulation result of single PA shows saturation output power of 10 dBm and total output power (P_tot) can be 16dBm.

Keywords

CMOS integrated circuits; millimetre wave amplifiers; millimetre wave antennas; power amplifiers; transmitters; frequency 60 GHz; multiantenna CMOS transmitter; power CMOS transmitter; power amplifier; wire-bond antenna; Antennas; Circuit faults; Microwave FETs; Microwave amplifiers; Transmitters; Wireless communication; 60GHz WPAN; Bond-wire Antenna; PA;

fLanguage

English

Publisher

ieee

Conference_Titel

Circuits and Systems (MWSCAS), 2011 IEEE 54th International Midwest Symposium on

Conference_Location

Seoul

ISSN

1548-3746

Print_ISBN

978-1-61284-856-3

Electronic_ISBN

1548-3746

Type

conf

DOI

10.1109/MWSCAS.2011.6026647

Filename

6026647