• DocumentCode
    3409003
  • Title

    A full-swing bootstrapped BiCMOS buffer

  • Author

    Brauer, Elizabeth J. ; Elamanchili, Pradeep

  • Author_Institution
    Dept. of Electr. Eng., Kentucky Univ., Lexington, KY, USA
  • fYear
    1997
  • fDate
    13-15 Mar 1997
  • Firstpage
    8
  • Lastpage
    13
  • Abstract
    Bipolar circuits have high drive capability with low delay sensitivity to load while CMOS circuits have low power dissipation and high packing density. Combining both bipolar and MOS transistors on one monolithic substrate, Bipolar-CMOS (BiCMOS) circuits have high drive capability and low power dissipation at the expense of increased fabrication complexity. A major problem with conventional BiCMOS circuits is the reduced output swing due to the bipolar output transistors. This paper presents a novel BiCMOS circuit which uses bootstrapping to attain a full logic swing at the output. We present a design equation to estimate the size of the bootstrap capacitance as a function of power supply voltage. Simulations were performed using parameters from a 2.0 μm CMOS process with NPN option at supply voltages of 3.3 and 5 V. The circuit is a practical design which improves on the delay and power performance of previous bootstrapped BiCMOS inverters
  • Keywords
    BiCMOS digital integrated circuits; BiCMOS logic circuits; bootstrap circuits; buffer circuits; circuit analysis computing; delays; integrated circuit design; logic design; logic gates; transient analysis; 2 mum; 2.0 μm CMOS process; 3.3 V; 5 V; bootstrap capacitance; bootstrapped BiCMOS inverters; delay performance; design equation; full logic swing; full-swing bootstrapped BiCMOS buffer; high drive capability; low power dissipation; power performance; power supply voltage dependence; propagation delay; simulations; transient analysis; BiCMOS integrated circuits; Bipolar transistor circuits; CMOS logic circuits; Delay; Drives; Fabrication; Logic circuits; MOSFETs; Power dissipation; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI, 1997. Proceedings. Seventh Great Lakes Symposium on
  • Conference_Location
    Urbana-Champaign, IL
  • ISSN
    1066-1395
  • Print_ISBN
    0-8186-7904-2
  • Type

    conf

  • DOI
    10.1109/GLSV.1997.580403
  • Filename
    580403