Title :
The electrodeposition and material properties of palladium nickel alloys
Author :
Abys, J.A. ; Kudrak, E.J. ; Maisano, J.J. ; Blair, A.
Author_Institution :
Lucent Technol., AT&T Bell Labs., Murray Hill, NJ, USA
Abstract :
The deregulation of gold in the early 1970s coupled with political and economic events of that era brought about an astronomical increase in its price in the late 1970´s and early 1980s. Since then gold has traded in the range of $320 to $440 per troy ounce, approximately ten times is price prior to deregulation. Thus, the major impetus for replacing gold as a contact material for electronic applications has been economic. Substituting palladium and palladium-nickel alloys for gold has proved to be highly rewarding. Not only is a significant cost reduction realized, but the technological advantages of this substitution are generally recognized today. This paper reports the development of a process for electroplating palladium-nickel films of compositions from 10 to 30 weight percent nickel. The material properties and contact reliability of the deposited films will also be presented
Keywords :
electrical contacts; electrochemistry; electroplating; metallic thin films; nickel alloys; palladium alloys; Pd-Ni; electrodeposition; electronic contact reliability; electroplating; material properties; palladium nickel alloy film; Conductivity; Costs; Current density; Gold alloys; Material properties; Materials reliability; Nickel alloys; Palladium; Space technology; Temperature;
Conference_Titel :
WESCON/96
Conference_Location :
Anaheim, CA
Print_ISBN :
0-7803-3274-1
DOI :
10.1109/WESCON.1996.554017