DocumentCode
3409356
Title
Automatic determination of pressure compensation factors without requiring wafer implants
Author
Halling, Mike ; Krull, Wade ; Chen, Hank ; Ring, Phil
Author_Institution
Semicond. Equipment Div., Eaton Corp., Beverly, MA, USA
Volume
1
fYear
1999
fDate
1999
Firstpage
312
Abstract
The ion beam is neutralized by interactions with the gas molecules present in the process chamber during wafer implant, and thus pressure compensation of this neutralization is necessary to deliver the proper dose. The parameters necessary for pressure compensation have traditionally been determined by a matrix of implants with various parameters. This paper describes a new method for accurately determining these factors without any wafer implants. The method involves measuring the beam neutralization that results from an intentionally created pressure ramp in the process chamber. Results will be shown for pressure compensation of shower gas mixtures. The method can be extended to photoresist outgassing using special mixtures of gases chosen to simulate the outgassing from photoresist. The new method is faster, much less expensive and is immune to nonimplant processing effects
Keywords
compensation; ion implantation; outgassing; photoresists; semiconductor doping; automatic determination; beam neutralization; gas molecules; ion beam; ion implanters; nonimplant processing effects; photoresist outgassing; pressure compensation factors; pressure ramp; process chamber; proper dose; shower gas mixtures; wafer implant; Charge measurement; Control systems; Current measurement; Dosimetry; Implants; Ion beams; Loss measurement; Magnetic flux; Pressure measurement; Resists;
fLanguage
English
Publisher
ieee
Conference_Titel
Ion Implantation Technology Proceedings, 1998 International Conference on
Conference_Location
Kyoto
Print_ISBN
0-7803-4538-X
Type
conf
DOI
10.1109/IIT.1999.812115
Filename
812115
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