Title :
Proceedings of the 1998 IEEE International Symposium on Electronics and the Environment. ISEE - 1998 (Cat. No.98CH36145)
Abstract :
The following topics were dealt with: product ECO-labelling; product take back; product and material recycling; disassembly methods; design for the environment; supplier management; product stewardship; environmental management; cradle to cradle management; end-of-life; life cycle assessment
Keywords :
environmental factors; cradle to cradle management; design for the environment; disassembly methods; electronics; end-of-life; environmental management; life cycle assessment; material recycling; product ECO labelling; product recycling; product stewardship; product take back; supplier management;
Conference_Titel :
Electronics and the Environment, 1998. ISEE-1998. Proceedings of the 1998 IEEE International Symposium on
Conference_Location :
Oak Brook, IL, USA
Print_ISBN :
0-7803-4295-X
DOI :
10.1109/ISEE.1998.675019
