DocumentCode
3409942
Title
Cooling and power considerations for semiconductors into the next century
Author
Belady, Christian
Author_Institution
Hewlett-Packard Co., Richardson, TX, USA
fYear
2001
fDate
2001
Firstpage
100
Lastpage
105
Abstract
With semiconductor power increasing rapidly, there is no doubt that package level cooling and infrastructure level power and cooling issues are important engineering problems to solve. Some of the relevant issues are discussed in this paper
Keywords
cooling; semiconductor device packaging; technological forecasting; thermal management (packaging); infrastructure-level cooling; infrastructure-level power delivery; package-level cooling; semiconductor chip; CMOS technology; Companies; Computer aided manufacturing; Electronic packaging thermal management; Electronics cooling; Permission; Power engineering and energy; Power engineering computing; Telecommunication computing; Thermal engineering;
fLanguage
English
Publisher
ieee
Conference_Titel
Low Power Electronics and Design, International Symposium on, 2001.
Conference_Location
Huntington Beach, CA
Print_ISBN
1-58113-371-5
Type
conf
DOI
10.1109/LPE.2001.945383
Filename
945383
Link To Document