Title :
Physics-of-failure: an approach to reliable product development
Author :
Pecht, Michael ; Dasgupta, Abhijit
Author_Institution :
CALCE Center for Electron. Packaging Res., Maryland Univ., College Park, MD, USA
Abstract :
Reliability assessments based on physics-of-failure methods incorporate reliability into the design process to prevent parts from failing in service. An understanding of the physics-of-failure is necessary in applications which afford little opportunity for testing, or for reliability growth. This paper presents an overview of physics-of-failure and a case study of the application of physics-of-failure to a specific failure mechanism called conductive filament formation.
Keywords :
design for manufacture; electronics industry; failure analysis; product development; reliability; conductive filament formation; design process; failure mechanism; physics-of-failure methods; reliability assessment; reliable product development; Aerospace materials; Costs; Electronics packaging; Failure analysis; Mathematical model; Process design; Product design; Product development; Thermal stresses; Virtual manufacturing;
Conference_Titel :
Integrated Reliability Workshop, 1995. Final Report., International
Conference_Location :
Lake Tahoe, CA, USA
Print_ISBN :
0-7803-2705-5
DOI :
10.1109/IRWS.1995.493566