Title :
Implementation of a WLR-program into a production line
Author :
Papp, A. ; Bieringer, F. ; Koch, D. ; Kammer, H. ; Kohlhase, A. ; Lill, A. ; Preussger, A. ; Schlemm, A. ; Schneegans, M.
Author_Institution :
Semicond. Group, Siemens AG, Munich, Germany
Abstract :
Describes the implementation of a process reliability monitoring program on the basis of wafer level tests into the control concept of a production line. For the main reliability parameters-gate oxide integrity, hot carrier injection immunity and metallization stability against electromigration-the methods, test structures, test conditions and results are presented. Some examples for reliability improvement and the future targets of the WLR-program are given.
Keywords :
electromigration; hot carriers; integrated circuit manufacture; integrated circuit metallisation; integrated circuit reliability; production testing; WLR-program; electromigration; gate oxide integrity; hot carrier injection immunity; metallization stability; process reliability monitoring; production line; test conditions; test structures; wafer level tests; Degradation; Electric variables measurement; Electromigration; Hot carrier injection; Monitoring; Production; Qualifications; Semiconductor device testing; Stability; Stress;
Conference_Titel :
Integrated Reliability Workshop, 1995. Final Report., International
Conference_Location :
Lake Tahoe, CA, USA
Print_ISBN :
0-7803-2705-5
DOI :
10.1109/IRWS.1995.493575
