DocumentCode

3411947

Title

Discussion group session summary: Package and die interactions

Author

Gee, Stephen ; Nguyen, Luu ; Sweet, Jim

fYear

1995

fDate

22-25 Oct. 1995

Firstpage

154

Keywords

Assembly; Bonding; Failure analysis; Life estimation; Manufacturing processes; Packaging; Robustness; Stress; Temperature; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Integrated Reliability Workshop, 1995. Final Report., International

Conference_Location

Lake Tahoe, CA, USA

Print_ISBN

0-7803-2705-5

Type

conf

DOI

10.1109/IRWS.1995.493592

Filename

493592