Title :
Discussion group session summary: Package and die interactions
Author :
Gee, Stephen ; Nguyen, Luu ; Sweet, Jim
Keywords :
Assembly; Bonding; Failure analysis; Life estimation; Manufacturing processes; Packaging; Robustness; Stress; Temperature; Testing;
Conference_Titel :
Integrated Reliability Workshop, 1995. Final Report., International
Conference_Location :
Lake Tahoe, CA, USA
Print_ISBN :
0-7803-2705-5
DOI :
10.1109/IRWS.1995.493592
