DocumentCode :
3412281
Title :
The effect of annealing temperature on the structure and dielectric properties of (Ba0.6Sr0.4)TiO3 thin films
Author :
Wu, Wenbiao ; Peng, Dongwen ; Liang, Xiaofeng ; Meng, Zhongyan
Author_Institution :
Sch. of Mater. Sci. & Eng., Shanghai Univ., China
fYear :
2002
fDate :
28 May-1 June 2002
Firstpage :
211
Lastpage :
214
Abstract :
Ba0.6Sr0.4TiO3 thin films were prepared on LaAlO3 substrates by sol-gel method. The effects of annealing temperature on the structure and dielectric properties were studied. The microstructure was examined by XRD, SEM and AFM. It was observed that as the annealing temperature increased, films were crystallized in preferential (001) orientation. When annealed at 1100°C, the films reveal agglomeration structure, and surface roughness increase. By the measurement, we found that the dielectric properties strongly depend upon annealing temperature. The higher the annealing temperature, the lower dissipation factor and the larger tunability will be. At the same thickness, the tunability of the films annealed at 1100°C enhanced to 46.9% (DC bias electric field of 80KV/cm) and the dissipation factor is 0.008 at 1 MHz.
Keywords :
X-ray diffraction; annealing; atomic force microscopy; barium compounds; dielectric materials; dielectric thin films; microwave materials; scanning electron microscopy; strontium compounds; surface topography; (Ba0.6Sr0.4)TiO3 thin film; 1100 degC; AFM; Ba0.6Sr0.4TiO3; LaAlO3; SEM; XRD; annealing; dielectric properties; dissipation factor; sol-gel method; structure; surface roughness; tunability; Annealing; Crystal microstructure; Crystallization; Dielectric substrates; Dielectric thin films; Rough surfaces; Strontium; Surface roughness; Temperature; X-ray scattering;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Applications of Ferroelectrics, 2002. ISAF 2002. Proceedings of the 13th IEEE International Symposium on
ISSN :
1099-4734
Print_ISBN :
0-7803-7414-2
Type :
conf
DOI :
10.1109/ISAF.2002.1195907
Filename :
1195907
Link To Document :
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