• DocumentCode
    3412555
  • Title

    Investigations of generic self disassembly using shape memory alloys

  • Author

    Chiodo, J D ; Billett, E.H. ; Harrison, D.J. ; Harry, P.

  • Author_Institution
    Brunel Univ., Egham, UK
  • fYear
    1998
  • fDate
    4-6 May 1998
  • Firstpage
    82
  • Lastpage
    87
  • Abstract
    Industrial recycling is a practice of growing importance while impending `Take Back´ European legislation and economic pressures are increasing. Landfill sites are becoming exhausted and the industry could benefit from a novel approach to recycling pre and post consumer waste. Cost constraints limit the number of different products that can be recycled. Recyclers are working on broadening the range of reusable components from this waste stream, but the proposed approach would significantly increase the volume of recyclable material used in manufacturing new products. This alternative could potentially reduce recycling cost per product in the event of mandatory recycling as a wide variety of consumer electronics could be actively or self disassembled on the same generic dismantling line. The use of Shape Memory Alloy (SMA) actuators in a wide variety of consumer electronic products in the same dismantling facility was tested. The candidate products had undergone a multi-stage hierarchical temperature regime on their macro and subassembly disassemblies and results reported. Two forms of SMA actuators were employed in the designs of actuators; these were one-way Nickel-Titanium (NiTi) and two-way Copper-Zinc-Aluminum (CuZnAl) actuators
  • Keywords
    actuators; consumer electronics; recycling; shape memory effects; CuZnAl; NiTi; SMA actuator; consumer electronic product; consumer waste; industrial recycling; self disassembly; shape memory alloy; take back; Actuators; Consumer electronics; Costs; Electronic equipment testing; Industrial economics; Legislation; Manufacturing; Recycling; Shape memory alloys; Waste materials;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics and the Environment, 1998. ISEE-1998. Proceedings of the 1998 IEEE International Symposium on
  • Conference_Location
    Oak Brook, IL
  • ISSN
    1095-2020
  • Print_ISBN
    0-7803-4295-X
  • Type

    conf

  • DOI
    10.1109/ISEE.1998.675036
  • Filename
    675036