DocumentCode :
3412744
Title :
Silicon-on-insulator based high-temperature electronics for automotive applications
Author :
Huque, M.A. ; Islam, S.K. ; Blalock, B.J. ; Su, C. ; Vijayaraghavan, R. ; Tolbert, L.M.
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., Univ. of Tennessee, Knoxville, TN
fYear :
2008
fDate :
June 30 2008-July 2 2008
Firstpage :
2538
Lastpage :
2543
Abstract :
In recent years increasing demand for hybrid electric vehicle has generated the need for reliable and low-cost high-temperature electronics which can operate at the extreme temperatures that exists under the hood. A high-voltage and high-temperature gate-driver integrated circuit for SiC FET switches is designed and implemented in a 0.8-micron Silicon-on-Insulator high-voltage process. First prototype chip has been successfully tested up to 200degC ambient temperature without any heat sink or cooling mechanism. This gate-driver chip is intended to drive SiC power FETs of the DC-DC converters in a hybrid electric vehicle. The converter modules along with the gate-driver chip will be placed very close to the engine where the temperature can reach up to 175degC. Successful operation of the chip at this temperature with or without minimal heat sink and without liquid cooling will help achieve greater power-to-volume as well as power-to-weight ratios for the power electronics module. A second prototype has also been designed with more robust features.
Keywords :
DC-DC power convertors; automotive electronics; field effect transistor switches; hybrid electric vehicles; power field effect transistors; silicon-on-insulator; DC-DC converters; FET switches; automotive electronics; high-temperature gate-driver integrated circuit; high-voltage gate-driver integrated circuit; hightemperature electronics; hybrid electric vehicle; power electronics; silicon-on-insulator; Automotive applications; FETs; Heat sinks; Hybrid electric vehicles; Hybrid power systems; Integrated circuit reliability; Prototypes; Silicon carbide; Silicon on insulator technology; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Industrial Electronics, 2008. ISIE 2008. IEEE International Symposium on
Conference_Location :
Cambridge
Print_ISBN :
978-1-4244-1665-3
Electronic_ISBN :
978-1-4244-1666-0
Type :
conf
DOI :
10.1109/ISIE.2008.4677170
Filename :
4677170
Link To Document :
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