A highly-integrated 3G CDMA2000 1X cellular baseband chip with GSM/AMPS/GPS/Bluetooth/multimedia capabilities and ZIF RIF support

Author

Arceo, J. ; Cheung, J. ; Lee, Jeyull ; Niu, Xin-liang ; Severson, M. ; Chang, Yuan-Chih ; King, Simon ; Lai, K.C. ; Tian, Yanjun ; Varadarajan, Srenivas ; Wang, Jiacheng ; Yen, Kyle ; Yuan, Lei ; Chen, Ni ; Hsu, David ; Lisk, Durodami ; Khan, Sharifullah

fYear

2004

fDate

15-19 Feb. 2004

Firstpage

422

Abstract

This paper presents a 3G CDMA2000 1X cellular-baseband chip, with GSM/AMPS/GPS/Bluetooth/multimedia capabilities, which uses an embedded ARM and two DSP processors. It is implemented with 27 M transistors in 46.9 mm² using a 130 nm dual-V_T low-power CMOS process and achieves a three to four times standby-time improvement by the selective use of footswitches.

Keywords

3G mobile communication; Bluetooth; CMOS integrated circuits; Global Positioning System; cellular radio; digital signal processing chips; low-power electronics; microprocessor chips; multimedia communication; multimedia computing; reduced instruction set computing; 130 nm; 3G CDMA2000; AMPS; Bluetooth; DSP processors; GPS; GSM; RISC processor; ZIF RIF support; dual-V_T low-power CMOS process; embedded ARM; footswitches; highly-integrated cellular baseband chip; multimedia; standby-time improvement; Baseband; Bluetooth; Chip scale packaging; Digital signal processing chips; GSM; Global Positioning System; Hardware; Multiaccess communication; Radio frequency; Telephony;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Circuits Conference, 2004. Digest of Technical Papers. ISSCC. 2004 IEEE International

ISSN

0193-6530

Print_ISBN

0-7803-8267-6

Type

conf

DOI

10.1109/ISSCC.2004.1332774

Filename

1332774