DocumentCode :
3415232
Title :
Energy-band engineering and characterization improvements by fluorine incorporation on Gd2O3 nanocrystal memory
Author :
Chao-Sung Lai ; Chih-Ting Lin ; Jer-Chyi Wang ; Chu-Fa Chan
Author_Institution :
Dept. of Electron. Eng., Chang Gung Univ., Taoyuan, Taiwan
fYear :
2012
fDate :
Oct. 29 2012-Nov. 1 2012
Firstpage :
1
Lastpage :
4
Abstract :
As a potential candidate for future nonvolatile memory (NVM) application, the discrete charge storage nodes formed as the nanocrystal (NC) structure has been caught much attention. Among the NC materials, high-k metal oxide is the unique one due to the mixed chemical reactions during high temperature forming process. The over-view of gadolinium oxide nanocrystal (Gd2O3-NC) memory is revealed in this paper. Gd2O3-NC was formed by one step rapid thermal annealing treated on the amorphous Gd2O3 film prepared by sputter system. The optical tests were conducted to exam the bandgap value of the Gd2O3-NC and the x-ray tests were conducted to exam the valence band offset. The charge trapping phenomenon can be characterized by the retention tests for various temperatures. Forming gas annealing was treated on the Gd2O3-NC to passivate the deep traps. A band engineered method by CF4 plasma treatment was also conducted to improve the memory characteristics.
Keywords :
amorphous semiconductors; carbon compounds; fluorine; gadolinium compounds; integrated memory circuits; nanostructured materials; random-access storage; rapid thermal annealing; CF4; Gd2O3; NC materials; NVM; amorphous film; charge trapping; deep traps passivation; energy-band engineering; high temperature forming process; high-k metal oxide; mixed chemical reactions; nanocrystal memory; nanocrystal structure; nonvolatile memory; optical tests; plasma treatment; rapid thermal annealing; retention tests; sputter system; x-ray tests; Charge carrier processes; Films; Logic gates; Photonic band gap; Plasmas; Silicon; Tunneling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State and Integrated Circuit Technology (ICSICT), 2012 IEEE 11th International Conference on
Conference_Location :
Xi´an
Print_ISBN :
978-1-4673-2474-8
Type :
conf
DOI :
10.1109/ICSICT.2012.6467581
Filename :
6467581
Link To Document :
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