Title :
Single chip RF front-end MMIC solutions for future low cost, miniature size, WLAN transceiver module applications
Author :
Yuen, Cindy ; Laursen, Kirk ; Adams, Mark ; Chu, Duc ; Nguyen, Hai
Author_Institution :
Epic Commun., Inc., Sunnyvale, CA, USA
Abstract :
Several highly integrated RF front-end modules (FEMs) for 802.11 b/g and a/b/g applications are described. In a single 4×4 mm or 5×5 mm QFN package, these FEMs include linearized power amplifier(s), a low-noise amplifier, T/R diversity switch, filters, diplexers, power detectors, and all biasing and matching circuitry. The RF FEMs replace over 30 discrete and IC components with a single package, and require practically no external components. They have the smallest footprint of any 802.11 FEM on the market and allow significant cost savings at the system level by reducing parts count, simplifying assembly, and increasing yield.
Keywords :
MMIC; integrated circuit packaging; wireless LAN; QFN package; RF front-end MMIC; RF front-end modules; WLAN transceiver module; biasing circuits; diplexer equipment; linearized power amplifiers; low-noise amplifier; matching circuits; power detectors; Costs; Low-noise amplifiers; MMICs; Packaging; Radio frequency; Radiofrequency amplifiers; Switches; Switching circuits; Transceivers; Wireless LAN; 802.11 a/b/g; 802.11 b/g; BT; CSP; DVB-H; GPS; GaAs HBT; GaAs MMIC; GaAs PHEMT; LTCC; PDA; QFN; RF Front-End Module (FEM); WLAN;
Conference_Titel :
Microwave Conference Proceedings, 2005. APMC 2005. Asia-Pacific Conference Proceedings
Print_ISBN :
0-7803-9433-X
DOI :
10.1109/APMC.2005.1606972