Title :
Implementation of On-Chip and On-Package Reactive Equalizer to Minimize Inter-symbol Interference (ISI) and Jitter from Frequency Dependent Attenuation
Author :
Ahn, Seungyoung ; Chun, Jongtae ; Kim, Joungho
Author_Institution :
Samsung Electron., Suwon
Abstract :
In this paper, on-chip and on-package reactive equalizer schemes that minimize inter-symbol interference (ISI) and jitter are proposed. The proposed reactive equalizers are designed and optimized in a frequency domain for 3 Gbps signaling on a transmission line with frequency dependent loss and parasitic capacitance. The proposed reactive equalizer was implemented using a 0.18 um CMOS process, and verification of improvements in the signal quality was performed via simulation and measurement of the time domain reflection and an eye diagram.
Keywords :
CMOS integrated circuits; equalisers; frequency-domain analysis; integrated circuit packaging; intersymbol interference; jitter; time-domain analysis; CMOS process; frequency dependent attenuation; intersymbol interference minimisation; jitter; on-package reactive equalizer; transmission line; Attenuation; Design optimization; Equalizers; Frequency dependence; Frequency domain analysis; Intersymbol interference; Jitter; Parasitic capacitance; Propagation losses; Signal design;
Conference_Titel :
Electromagnetic Compatibility, 2007. EMC 2007. IEEE International Symposium on
Conference_Location :
Honolulu, HI
Print_ISBN :
1-4244-1349-4
Electronic_ISBN :
1-4244-1350-8
DOI :
10.1109/ISEMC.2007.59