• DocumentCode
    3416240
  • Title

    EM Fields Between Two Parallel Plates Supported by Conductive Multi-Poles - Pole-Plate System: Shield Effectiveness and Field Leakage

  • Author

    Aizawa, Kazuo ; Echigo, Hiroshi

  • Author_Institution
    Tohoku Gakuin Univ., Tagajo City
  • fYear
    2007
  • fDate
    9-13 July 2007
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    In conductive multi-plates such as printed circuit boards (PCB) or pin grid array (PGA) connectors of CPU ICs, EM fields should be analyzed because undesired coupling between Vias and Pins may occur. In addition, the shield effectiveness of the pin array in preventing the leakage of EM field should be estimated. In this paper, some examples are shown to prove that the analysis method for the scattering of a multi-wire system is effective. Some calculation results giving the electric near-field images are presented for thin-wire systems and multi-plate conductors. They clearly give the field pattern caused by scattering out of the pole conductors. These results will give intuitive estimations of the EMI and lead to better treatments in the design.
  • Keywords
    conducting bodies; electromagnetic compatibility; electromagnetic fields; electromagnetic shielding; electromagnetic wave scattering; printed circuits; CPU IC; EM fields; EMC problems; PGA connectors; conductive multiplates; conductive multipoles; electric near-field images; field leakage; multiwire system scattering; parallel plates; pin grid array; pole-plate system; printed circuit boards; shield effectiveness; thin-wire systems; Cities and towns; Conductors; Connectors; Electromagnetic interference; Electromagnetic scattering; Electronics packaging; Equations; Magnetic shielding; Printed circuits; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility, 2007. EMC 2007. IEEE International Symposium on
  • Conference_Location
    Honolulu, HI
  • Print_ISBN
    1-4244-1349-4
  • Electronic_ISBN
    1-4244-1350-8
  • Type

    conf

  • DOI
    10.1109/ISEMC.2007.69
  • Filename
    4305649