• DocumentCode
    3416351
  • Title

    Electronic properties of PECVD hydrogenated amorphous silicon with predominantly monohydride bonding deposited at less than 150°C

  • Author

    Srinivasan, Easwar ; Parsons, Gregory N.

  • Author_Institution
    Dept. of Chem. Eng., North Carolina State Univ., Raleigh, NC, USA
  • fYear
    1995
  • fDate
    25-26 Sep 1995
  • Firstpage
    20
  • Lastpage
    23
  • Abstract
    PECVD hydrogenated amorphous silicon (a-Si:H) prepared with silane, typically has predominant monohydride bonding only at substrate temperatures above 200°C. Using rf plasma enhanced chemical vapor deposition, we have deposited a-Si:H films at a substrate temperature near 30% using silane diluted with helium, and found that films with dominant monohydride configuration can be deposited without significant substrate heating. As deposited, the films with predominant monohydride bonding show low dark conductivity (10-9 S/cm) and photoconductivity (20-7 S/cm at near AM1 illumination). However, annealing the films for 3 hours at 150%, improved the photo to dark conductivity ratio by a factor of 102. These films may be valuable for the fabrication of thin film electronics on low temperature substrates
  • Keywords
    amorphous semiconductors; annealing; dark conductivity; elemental semiconductors; photoconductivity; plasma CVD; semiconductor technology; silicon; 150 C; 200 C; 3 h; 30 C; PECVD hydrogenated amorphous silicon; Si:H; a-Si:H films; annealing; low temperature substrates; monohydride bonding; photo to dark conductivity ratio; photoconductivity; rf plasma enhanced chemical vapor deposition; silane; substrate temperature; substrate temperatures; thin film electronics; Amorphous silicon; Bonding; Chemical vapor deposition; Conductive films; Conductivity; Helium; Plasma chemistry; Plasma properties; Plasma temperature; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Active Matrix Liquid Crystal Displays, 1995. AMLCDs '95., Second International Workshop on
  • Conference_Location
    Bethlehem, PA
  • Print_ISBN
    0-7803-3056-0
  • Type

    conf

  • DOI
    10.1109/AMLCD.1995.540951
  • Filename
    540951