DocumentCode :
3416693
Title :
Ultra low on-resistance Super 3D MOSFET under 300 V breakdown voltage
Author :
Sakakibara, Jun ; Urakami, Yasushi ; Yamaguchi, Hitoshi
Author_Institution :
Res. Labs., DENSO CORPORATION, Aichi, Japan
fYear :
2004
fDate :
24-27 May 2004
Firstpage :
209
Lastpage :
212
Abstract :
For the range of under 300 V breakdown voltage, we have already proposed a new structural power MOSFET that we call Super 3D MOSFET. At 70 V breakdown voltage, the simulated total specific on-resistance was 19 mohm.mm2, and below the Ron Si limit. In this work, we present the structural design for the breakdown voltage, taking the electric field concentration into consideration at its 3-dimensional corner. Furthermore, we present the experimental results for an actual prototype fabrication. The on-resistance and breakdown voltage are respectively 27 mohm.mm2 and 49 V. This on-resistance is reduced drastically in comparison with the conventional trench-gated MOSFET.
Keywords :
electric resistance; power MOSFET; semiconductor device breakdown; 49 V; 70 V; MOSFET structural design; Super 3D MOSFET; breakdown voltage; channel widening; current path widening; drift path; electric field concentration; power MOSFET; three dimensional MOSFET; trench gate edge; ultra low on-resistance; Power MOSFETs; Resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Semiconductor Devices and ICs, 2004. Proceedings. ISPSD '04. The 16th International Symposium on
Print_ISBN :
4-88686-060-5
Type :
conf
DOI :
10.1109/ISPSD.2004.1332902
Filename :
1332902
Link To Document :
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