Title :
Power Delivery for High Performance Processor Packages - Part I
Author :
Hockanson, David M. ; Dibene, J. Ted
Author_Institution :
Sun Microsyst. Inc., Stanford
Abstract :
The continued reduction in processor core voltage, increases in current required, chip density and size place more pressure on effectively controlling the impedance of a CPU power distribution system. Voltage fluctuations across the die limit functionality and speed. The core-power path from the die to the voltage regulator is discussed herein. The path is separated into segments, and a one-dimensional circuit model is created to aid in the discussion.
Keywords :
cores; electronics packaging; voltage regulators; CPU power distribution system; chip density; high performance processor packages; power delivery; processor core voltage; voltage fluctuations; voltage regulator; Circuits; Control systems; Impedance; Packaging; Power distribution; Pressure control; Regulators; Size control; Voltage control; Voltage fluctuations;
Conference_Titel :
Electromagnetic Compatibility, 2007. EMC 2007. IEEE International Symposium on
Conference_Location :
Honolulu, HI
Print_ISBN :
1-4244-1349-4
Electronic_ISBN :
1-4244-1350-8
DOI :
10.1109/ISEMC.2007.98