DocumentCode
3416783
Title
Benchmark market pricing for single and multichip substrates
Author
Christensen, Mark V.
Author_Institution
Prismark Parners LLC, Cold Spring Harbor, NY, USA
fYear
1997
fDate
2-4 Apr 1997
Firstpage
7
Lastpage
10
Abstract
Global pricing for substrates used in single and multichip modules is changing rapidly. Factors such as the market pressure on cofired ceramic substrates from high density organic substrates, the economics of large area processing for thin film, flexible film and built up multilayers, the establishment of new viable suppliers and real market demand are all contributing to price reduction. This paper, based on global surveys, places current market pricing in its historical context and provides forecasts for the major categories of substrate used in single and multichip modules
Keywords
costing; economics; integrated circuit manufacture; multichip modules; substrates; benchmark market pricing; built up multilayer; cofired ceramic substrate; economics; flexible film; global survey; high density organic substrate; large area processing; multichip module; single chip module; thin film; Bonding; Ceramics; Costs; Multichip modules; Packaging; Pricing; Silicon; Substrates; Transistors; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Multichip Modules, 1997., International Conference on
Conference_Location
Denver, CO
Print_ISBN
0-7803-3787-5
Type
conf
DOI
10.1109/ICMCM.1997.581137
Filename
581137
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