Title :
Trends in flip chip and advanced interconnection
Author :
Francis, David H.
Author_Institution :
Int. Interconnection Intelligence, Montara, CA, USA
Abstract :
In the flip chip and advanced interconnect area, the number of patents being filed and awarded each year, continues to increase. Over the five year period 1990 to 1995, the average annual growth rate of patents issued in the US in this technology area was 44%. This paper discusses some of the more interesting patents
Keywords :
flip-chip devices; integrated circuit interconnections; patents; USA; advanced interconnect area; flip chip interconnection; patents; technology area; Artificial intelligence; Electric breakdown; Flip chip; Intellectual property; Investments; Large scale integration; Logic; Multichip modules; Packaging; Wire;
Conference_Titel :
Multichip Modules, 1997., International Conference on
Conference_Location :
Denver, CO
Print_ISBN :
0-7803-3787-5
DOI :
10.1109/ICMCM.1997.581141
