A family of high performance MCM-C/D packages utilizing cofired alumina multilayer ceramic and a shielded thin film redistribution structure

Author

Shutler, William ; Longworth, Hai ; Pennacchia, John ; Perfecto, Eric ; Shields, Ron

Author_Institution

IBM Microelectron., Hopewell Junction, NY, USA

fYear

1997

fDate

2-4 Apr 1997

Firstpage

35

Lastpage

42

Abstract

A family of high performance MCM-C/D packages which are used in the new IBM S390 Enterprise G3 and Multiprise systems is described. The packages are constructed of a shielded thin film redistribution structure on a multilayer cofired alumina/molybdenum pinned substrate. Two sizes are described supporting up to 34 CMOS ASIC chips with high signal counts along with other components. The G3 MCM is hermetically sealed while the MP MCM is nonhermetic. Both packages are qualified for 100 K power on hours and 2500 field on/off cycles

Keywords

alumina; application specific integrated circuits; ceramics; integrated circuit packaging; multichip modules; seals (stoppers); shielding; Al₂O₃; CMOS ASIC chips; IBM S390 Enterprise G3; Multiprise systems; field on/off cycles; hermetic seal; high performance MCM-C/D packages; multilayer ceramic; pinned substrate; shielded thin film redistribution structure; signal counts; Application specific integrated circuits; Ceramics; Multichip modules; Nonhomogeneous media; Packaging; Substrates; Surface impedance; Switches; Transistors; Wiring;

fLanguage

English

Publisher

ieee

Conference_Titel

Multichip Modules, 1997., International Conference on

Conference_Location

Denver, CO

Print_ISBN

0-7803-3787-5

Type

conf

DOI

10.1109/ICMCM.1997.581143

Filename

581143