Title :
A family of high performance MCM-C/D packages utilizing cofired alumina multilayer ceramic and a shielded thin film redistribution structure
Author :
Shutler, William ; Longworth, Hai ; Pennacchia, John ; Perfecto, Eric ; Shields, Ron
Author_Institution :
IBM Microelectron., Hopewell Junction, NY, USA
Abstract :
A family of high performance MCM-C/D packages which are used in the new IBM S390 Enterprise G3 and Multiprise systems is described. The packages are constructed of a shielded thin film redistribution structure on a multilayer cofired alumina/molybdenum pinned substrate. Two sizes are described supporting up to 34 CMOS ASIC chips with high signal counts along with other components. The G3 MCM is hermetically sealed while the MP MCM is nonhermetic. Both packages are qualified for 100 K power on hours and 2500 field on/off cycles
Keywords :
alumina; application specific integrated circuits; ceramics; integrated circuit packaging; multichip modules; seals (stoppers); shielding; Al2O3; CMOS ASIC chips; IBM S390 Enterprise G3; Multiprise systems; field on/off cycles; hermetic seal; high performance MCM-C/D packages; multilayer ceramic; pinned substrate; shielded thin film redistribution structure; signal counts; Application specific integrated circuits; Ceramics; Multichip modules; Nonhomogeneous media; Packaging; Substrates; Surface impedance; Switches; Transistors; Wiring;
Conference_Titel :
Multichip Modules, 1997., International Conference on
Conference_Location :
Denver, CO
Print_ISBN :
0-7803-3787-5
DOI :
10.1109/ICMCM.1997.581143
