Title :
Direct copper electrodeposition onto cobalt adhesion layer in alkaline bath
Author :
Wen-Zhong Xu ; Jing-Xuan Wang ; Hai-Sheng Lu ; Xu Zeng ; Jing-Bo Xu ; Xin-Ping Qu
Author_Institution :
Dept. of Microelectron., Fudan Univ., Shanghai, China
fDate :
Oct. 29 2012-Nov. 1 2012
Abstract :
The direct electroplating of copper film on an ultrathin cobalt film in the alkaline bath was investigated. The plating bath consists of CuSO4·5H2O and ethylenediamine. It is found that the ethylenediamine can well stop the cobalt reaction with copper ion and make the copper deposition on cobalt possible. The experimental results show that the copper films on the cobalt have a high preferential (111) orientation, very low surface roughness and low resistivity.
Keywords :
adhesion; copper; copper compounds; electroplating; hydrogen compounds; sulphur compounds; surface roughness; CuSO4H2O; alkaline bath; cobalt adhesion layer; cobalt reaction; copper film; copper ion; direct copper electrodeposition; direct electroplating; ethylenediamine; plating bath; surface roughness; ultrathin cobalt film; Cobalt; Conductivity; Copper; Current density; Films; Resistance; Surface morphology;
Conference_Titel :
Solid-State and Integrated Circuit Technology (ICSICT), 2012 IEEE 11th International Conference on
Conference_Location :
Xi´an
Print_ISBN :
978-1-4673-2474-8
DOI :
10.1109/ICSICT.2012.6467673
