DocumentCode :
3416943
Title :
Backside reflector using metallic mirror and ALD-TiO2/Al2O3 DBR for GaN-based LED
Author :
Hongjun Chen ; Shengkai Wang ; Bing Sun ; Hao Guo ; Wei Zhao ; Hudong Chang ; Xiong Zhang ; Honggang Liu
Author_Institution :
Microwave Device & IC Dept., Inst. of Microelectron., Beijing, China
fYear :
2012
fDate :
Oct. 29 2012-Nov. 1 2012
Firstpage :
1
Lastpage :
3
Abstract :
In this work, high reflectivity backside reflectors combining TiO2/Al2O3 distributed Bragg reflector (DBR) by atomic layer deposition (ALD) with metallic mirror have been demonstrated for the first time. Multi-pair-DBRs/Al and multi-pair-DBRs/Ag stacks with excellent uniformity and thickness accuracy have exhibited high reflectance above 96%. Optimized thicknesses of Al2O3 (67 nm) and TiO2 (49 nm) were figured out to achieve the highest reflectance. The reflectance of the fabricated backside reflectors were verified by both simulation and spectroscopic ellipsometry measurement, and the measured data coincide with the simulated data well. Since TiO2/Al2O3 DBR has good adhesion with both sapphire substrate and Al mirror, we simplified the fabrication process and achieved more stabilized backside reflector. By combining ALD deposition with TiO2/Al2O3 DBR, high reflectivity, less angle dependency, more stabilized and excellent film uniformity backside reflector is achieved to meet the requirements of high brightness light-emitting diodes (LEDs).
Keywords :
III-V semiconductors; alumina; atomic layer deposition; distributed Bragg reflectors; gallium compounds; light emitting diodes; reflectivity; sapphire; titanium compounds; wide band gap semiconductors; ALD; GaN; LED; TiO2-Al2O3; atomic layer deposition; backside reflectors; distributed Bragg reflector; film uniformity; light emitting diodes; metallic mirror; sapphire substrate; size 49 nm; size 67 nm; spectroscopic ellipsometry measurement; thickness accuracy; Aluminum oxide; Distributed Bragg reflectors; Light emitting diodes; Photonics; Reflection; Reflectivity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State and Integrated Circuit Technology (ICSICT), 2012 IEEE 11th International Conference on
Conference_Location :
Xi´an
Print_ISBN :
978-1-4673-2474-8
Type :
conf
DOI :
10.1109/ICSICT.2012.6467677
Filename :
6467677
Link To Document :
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