DocumentCode :
3416971
Title :
Efficient 3D Simulation of Thin Conducting Layers of Arbitrary Thickness
Author :
Eriksson, Göran
Author_Institution :
Saab AB, Linkoping
fYear :
2007
fDate :
9-13 July 2007
Firstpage :
1
Lastpage :
6
Abstract :
In this paper it is demonstrated how a class of relatively complex EMC simulations can be performed at a low cost, both in terms of time and money. Using a symmetric, two- way boundary condition formulation, shielding metal layers can be included in a global electromagnetic simulation, without the need to resolve in detail the interior of the layer. This formulation, which has been previously used for some specific microwave and EMC problems, has no restrictions on the ratio of layer thickness to the skin depth. It is implemented in a commercial finite element (FEM) solver installed on a standard PC and no source-code programming is required. The method is validated and its usefulness demonstrated by applying it to a number of 3D examples of general EMC relevance.
Keywords :
electromagnetic compatibility; electromagnetic shielding; finite element analysis; 3D simulation; boundary condition formulation; complex EMC simulation; electromagnetic compatibility; finite element method; shielding metal layer; thin conducting layer; Computational modeling; Computer simulation; Conducting materials; Conductivity; Costs; Electromagnetic compatibility; Electromagnetic shielding; Propagation losses; Radio frequency; Skin;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetic Compatibility, 2007. EMC 2007. IEEE International Symposium on
Conference_Location :
Honolulu, HI
Print_ISBN :
1-4244-1349-4
Electronic_ISBN :
1-4244-1350-8
Type :
conf
DOI :
10.1109/ISEMC.2007.110
Filename :
4305690
Link To Document :
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