Low-Cost Flip Chip Consortium-first year results

The Low-Cost Flip Chip Consortium is a funded Technology Reinvestment Project (TRP) effort to establish a domestic infrastructure for the manufacturing of low-cost flip chip assemblies, from wafer fabrication to final product assembly. This two-year program, $21 M cost-shared effort, involves nine U.S. companies serving the military and commercial electronics market: Aptos, Delco Electronics, Hughes Missile Systems, Jabil Circuit Litronic Industries, Motorola, Sheldahl, SanDisk, and National Semiconductor. Four focus areas are addressed by the consortium: 1. Low-cost wafer and die bumping; 2. Low-cost laminate substrate design and fabrication; 3. Flip chip assembly on laminate substrates; and, 4. Process verification through end-product builds. The program is currently in its second year. A number of accomplishments has been achieved in all four Focus Areas. This paper will present highlights of the first year of the program