Low-Cost Flip Chip Consortium-first year results

Author

Nguyen, L. ; Baker, M.

Author_Institution

Nat. Semicond. Corp., Santa Clara, CA, USA

fYear

1997

fDate

2-4 Apr 1997

Firstpage

98

Lastpage

103

Abstract

The Low-Cost Flip Chip Consortium is a funded Technology Reinvestment Project (TRP) effort to establish a domestic infrastructure for the manufacturing of low-cost flip chip assemblies, from wafer fabrication to final product assembly. This two-year program, $21 M cost-shared effort, involves nine U.S. companies serving the military and commercial electronics market: Aptos, Delco Electronics, Hughes Missile Systems, Jabil Circuit Litronic Industries, Motorola, Sheldahl, SanDisk, and National Semiconductor. Four focus areas are addressed by the consortium: 1. Low-cost wafer and die bumping; 2. Low-cost laminate substrate design and fabrication; 3. Flip chip assembly on laminate substrates; and, 4. Process verification through end-product builds. The program is currently in its second year. A number of accomplishments has been achieved in all four Focus Areas. This paper will present highlights of the first year of the program

Keywords

flip-chip devices; Low-Cost Flip Chip Consortium; Technology Reinvestment Project; US companies; commercial electronics market; die bumping; domestic infrastructure; flip chip manufacturing; laminate substrate; military electronics market; process verification; product assembly; wafer bumping; wafer fabrication; Assembly; Circuits; Consumer electronics; Fabrication; Flip chip; Industrial electronics; Laminates; Missiles; Semiconductor device manufacture; Substrates;

fLanguage

English

Publisher

ieee

Conference_Titel

Multichip Modules, 1997., International Conference on

Conference_Location

Denver, CO

Print_ISBN

0-7803-3787-5

Type

conf

DOI

10.1109/ICMCM.1997.581155

Filename

581155