• DocumentCode
    3417317
  • Title

    Ka-band LNA module with 1.9dB NF for communications satellite payload

  • Author

    Chang, D.P. ; Yom, I.B. ; Oh, S.H.

  • Author_Institution
    Electron. & Telecommun. Res. Inst., Daejeon, South Korea
  • Volume
    5
  • fYear
    2005
  • fDate
    4-7 Dec. 2005
  • Abstract
    A LNA module, integrated microwave assembly was developed for Ka-band communications satellite payload in the frequency range of 29.6 ∼ 30.0 GHz. The noise figure of the module has been recorded as low as 1.9dB at ambient temperature. The module has been tested over temperature range of -15 ∼ +71°C and shows 33.3dB of gain within 0.7dBp-o variation as it has the function of gain compensation. The mass of the module is 94grams that provides the flexibility in payload assembly. Two low noise amplifier MMIC chips were used in the module and those chips had been fabricated using 0.15 μm GaAs pHEMT process. This paper describes the design, fabrication and performance of the LNA module. This will include the MMIC design, the mechanical design of module, and the design of waveguide-to-microstrip transition.
  • Keywords
    III-V semiconductors; MMIC amplifiers; circuit noise; gallium arsenide; high electron mobility transistors; low noise amplifiers; modules; network synthesis; 0.094 kg; 0.15 μm GaAs pHEMT process; 0.15 micron; 29.6 to 30.0 GHz; 33.3 dB; GaAs; Ka-band; LNA module; MMIC chip; communications satellite payload; integrated microwave assembly; noise figure; waveguide-to-microstrip transition; Artificial satellites; Assembly; Frequency; Low-noise amplifiers; MMICs; Noise figure; Noise measurement; Payloads; Temperature distribution; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Conference Proceedings, 2005. APMC 2005. Asia-Pacific Conference Proceedings
  • Print_ISBN
    0-7803-9433-X
  • Type

    conf

  • DOI
    10.1109/APMC.2005.1607073
  • Filename
    1607073