Title :
Development of an integrated LTCC Bluetooth module
Author :
Yeung, Lap K. ; Wang, Jie ; Huang, Yong ; Lee, Shu-Chuen ; Wu, Ke-Li
Author_Institution :
Dept. of Electron. Eng., Chinese Univ. of Hong Kong, China
Abstract :
In this paper, a system-on-package (SoP) approach for Bluetooth system modules using low temperature co-fired ceramic (LTCC) substrate technology is presented. The proposed Bluetooth module is overall 12mm by 12mm in size, with integration of two originally proposed components, a balanced-to-unbalanced filter and an antenna, as well as other passive circuitries. The embedded balanced-to-unbalanced filter, which is derived from the basic center-tapped transformer circuit, works simultaneously as a balun and a bandpass filter, thus leads to a significant amount of size reduction for the overall module. Likewise, comparing with the usual half-wavelength printed antennas, our proposed antenna is only one-tenth of wavelength in size without sacrificing of efficiency. Consequently, couplings among various embedded components of this highly integrated module are crucial to its performance and the resulting effects are discussed. A fully functional prototype has been successfully fabricated, showing a promising solution for Bluetooth applications.
Keywords :
Bluetooth; baluns; band-pass filters; ceramic packaging; microstrip antennas; modules; system-in-package; 12 mm; Bluetooth module; LTCC substrate technology; SoP; balanced-unbalanced filter; balun; bandpass filter; half-wavelength printed antennas; low temperature co-fired ceramic technology; passive circuit; system-on-package; transformer circuit; Antenna accessories; Band pass filters; Bluetooth; Ceramics; Coupling circuits; Impedance matching; Integrated circuit technology; Passive filters; Prototypes; Temperature; Bluetooh; LTCC; system-on-package;
Conference_Titel :
Microwave Conference Proceedings, 2005. APMC 2005. Asia-Pacific Conference Proceedings
Print_ISBN :
0-7803-9433-X
DOI :
10.1109/APMC.2005.1607081