• DocumentCode
    3417509
  • Title

    Statistical process control applied to automated dispense of silver filled epoxy for commercial millimeter wave multi chip module

  • Author

    Spinazzola, Robert

  • Author_Institution
    Procss Technol. Group, AMP Co., Lowell, MA, USA
  • fYear
    1997
  • fDate
    2-4 Apr 1997
  • Firstpage
    228
  • Lastpage
    233
  • Abstract
    This paper presents the results of continuous improvement from: Designed Experiments, Viscosity measurements, Statistical Process Control, documented operating procedures, and operator training and certification; on the automated epoxy dispense process. This capability enables the company; M/A-COM, to produce the first volume low cost 28 GHz Commercial Millimeter Wave Multi Chip Module Receiver. The Millimeter Wave Multi Chip Module Receiver uses GaAs Phempts measuring 12 by 10 mil length and width by 5 mil thick. This small discrete device required the development of a process for a ten mil diameter silver paste epoxy dot: repeatable, in production, and in volume. Statistically Designed Experiments were used to identify and set the most important process parameters. Viscosity measurements were made which characterized the silver filled epoxy paste. The ASTM methods for measuring viscosity of adhesives were modified to identify the material´s sensitivity to shear. A unique Statistical Process Control method was implemented to establish process control over a material which has proven to change flow behavior during processing through an auger type positive displacement pump. The key to the success of this project has been properly train operators
  • Keywords
    design of experiments; filled polymers; integrated circuit manufacture; millimetre wave integrated circuits; millimetre wave receivers; multichip modules; statistical process control; viscosity measurement; 28 GHz; ASTM method; Ag; Auger type positive displacement pump; GaAs; GaAs PHEMT; M/A-COM; adhesive; automated dispense; commercial millimeter wave multi chip module receiver; designed experiment; documented operating procedure; operator certification; operator training; silver filled epoxy; statistical process control; viscosity measurement; Certification; Continuous improvement; Costs; Gallium arsenide; Millimeter wave measurements; Millimeter wave technology; Process control; Semiconductor device measurement; Silver; Viscosity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Multichip Modules, 1997., International Conference on
  • Conference_Location
    Denver, CO
  • Print_ISBN
    0-7803-3787-5
  • Type

    conf

  • DOI
    10.1109/ICMCM.1997.581180
  • Filename
    581180