DocumentCode :
3417842
Title :
Transaction level modeling tradeoff on accuracy and speed: A case study
Author :
Su, Jiao ; Guo, Wei ; Wei, Jizeng ; Shi, Shaofei ; Jiang, Bin
Author_Institution :
Sch. of Comput. Sci. & Technol., Tianjin Univ., Tianjin, China
Volume :
5
fYear :
2010
fDate :
25-27 June 2010
Abstract :
Nowadays, electronic system level (ESL) design has attracted more and more attentions as it could help designers in SoC architecture design and HW/SW co-verification in early design stage hence reducing time-to-market. In this paper we propose a transaction level modeling (TLM) method for architecture design space exploration in ESL design environment. This method offers a modeling and simulation speedup and still provides relatively accurate performance evaluation. As a case study the proposed method has been used to model 32-bit C*CORE CPU and C*Core Local Bus (CLB). In these models a multi-clock triggered wrapper is proposed to meet the cycle accurate requirement,and an index method is used for variable-length opcode decoding. In order to verify the effectiveness of our work, we have built a SoC in ESL design environment. Simulation results show that our method enables efficient and accurate design evaluation in early design phase.
Keywords :
hardware-software codesign; system-on-chip; C*CORE CPU; C*Core Local Bus; ESL design environment; SoC architecture design; architecture design space exploration; electronic system level; hardware-software coverification; multiclock triggered wrapper; system-on-chip; transaction level modeling; variable-length opcode decoding; Computer architecture; Computer science; Decoding; Embedded software; Hardware; Microprocessors; Object oriented modeling; Software design; Space exploration; Time to market; C*CORE; CLB; ESL; TLM; VCI;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Computer Design and Applications (ICCDA), 2010 International Conference on
Conference_Location :
Qinhuangdao
Print_ISBN :
978-1-4244-7164-5
Electronic_ISBN :
978-1-4244-7164-5
Type :
conf
DOI :
10.1109/ICCDA.2010.5540834
Filename :
5540834
Link To Document :
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