Title :
Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces
Abstract :
The following topics were dealt with. Polymer dielectric materials; board materials; encapsulants; BGAs; plastic package materials; direct chip attach; material mechanics; microwave materials; ceramic material; and optoelectronic materials
Keywords :
ceramics; dielectric materials; encapsulation; integrated circuit packaging; optoelectronic devices; plastic packaging; printed circuits; surface mount technology; BGAs; board materials; ceramic material; direct chip attach; encapsulants; material mechanics; microwave materials; optoelectronic materials; plastic package materials; polymer dielectric materials;
Conference_Titel :
Advanced Packaging Materials. Proceedings., 3rd International Symposium on
Conference_Location :
Braselton, GA, USA
Print_ISBN :
0-7803-3818-9
DOI :
10.1109/ISAPM.1997.581240
