Title :
New material technology for high density interconnections
Author :
Johnson, Daniel D.
Author_Institution :
W.L. Gore & Assoc., Elkton, MD, USA
Abstract :
A new technology is discussed that allows for the efficient interconnection of Surface Mounted Components (SMC) to high density substrates. This technology is based on the selective through metalization of porous, expanded polytetrafluoroethylene (ePTFE) membranes using a photoimaging process. The selective metalized membrane can be coated or filled with resins or adhesives to yield an Anisotropic Z-Axis Interface
Keywords :
integrated circuit interconnections; integrated circuit metallisation; surface mount technology; anisotropic z-axis interface; ePTFE; high density interconnection; material technology; photoimaging; porous expanded polytetrafluoroethylene membrane; selective through metalization; surface mounted component; Biomembranes; Chip scale packaging; Contact resistance; Electronics packaging; Integrated circuit interconnections; Lead; Materials science and technology; Resins; Sliding mode control; Surface resistance;
Conference_Titel :
Advanced Packaging Materials. Proceedings., 3rd International Symposium on
Conference_Location :
Braselton, GA
Print_ISBN :
0-7803-3818-9
DOI :
10.1109/ISAPM.1997.581247
