DocumentCode
3418137
Title
Chemical-mechanical planarization
Author
Roberts, Bob
fYear
1992
fDate
30 Sep-1 Oct 1992
Firstpage
206
Lastpage
210
Abstract
The chemical-mechanical planarization (CMP) techniques applied to insulating layers in multilayered integrated circuits are discussed. Advantages and concerns of CMP are considered. Process developments are described
Keywords
Conducting materials; Dielectrics and electrical insulation; Etching; Fabrication; Integrated circuit interconnections; Planarization; Semiconductivity; Semiconductor device manufacture; Silicon; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing Conference and Workshop, 1992. ASMC 92 Proceedings. IEEE/SEMI 1992
Conference_Location
Cambridge, MA
Print_ISBN
0-7803-0740-2
Type
conf
DOI
10.1109/ASMC.1992.253791
Filename
253791
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