Title :
Colamination technology for electronic packaging applications
Author :
Leach, Sarah E. ; Ernsberger, Craig N.
Author_Institution :
CTS Corp., Elkhart, IN, USA
Abstract :
"Colamination" is a packaging technology that, in many ways, is a cost effective organic version of Cofire ceramic. The Colamination process and material sets have been in development at CTS for several years. An extensive reliability database has been developed for Colaminated substrates through fabrication of various test vehicles and prototypes. Recent work by CTS involves qualification of Colaminated substrates in several customer applications. This abstract briefly describes Colamination technology and some prototype work CTS has been involved with. We also describe some recent technical developments in Colamination technology
Keywords :
packaging; CTS; colamination technology; electronic packaging; multilayer interconnect; organic material; reliability database; substrate; Assembly; Bonding; Ceramics; Circuits; Dielectric materials; Disk drives; Electronics packaging; Magnetic heads; Nonhomogeneous media; Semiconductor materials;
Conference_Titel :
Advanced Packaging Materials. Proceedings., 3rd International Symposium on
Conference_Location :
Braselton, GA
Print_ISBN :
0-7803-3818-9
DOI :
10.1109/ISAPM.1997.581250