DocumentCode
3418152
Title
Colamination technology for electronic packaging applications
Author
Leach, Sarah E. ; Ernsberger, Craig N.
Author_Institution
CTS Corp., Elkhart, IN, USA
fYear
1997
fDate
9-12 Mar 1997
Firstpage
38
Lastpage
41
Abstract
"Colamination" is a packaging technology that, in many ways, is a cost effective organic version of Cofire ceramic. The Colamination process and material sets have been in development at CTS for several years. An extensive reliability database has been developed for Colaminated substrates through fabrication of various test vehicles and prototypes. Recent work by CTS involves qualification of Colaminated substrates in several customer applications. This abstract briefly describes Colamination technology and some prototype work CTS has been involved with. We also describe some recent technical developments in Colamination technology
Keywords
packaging; CTS; colamination technology; electronic packaging; multilayer interconnect; organic material; reliability database; substrate; Assembly; Bonding; Ceramics; Circuits; Dielectric materials; Disk drives; Electronics packaging; Magnetic heads; Nonhomogeneous media; Semiconductor materials;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Packaging Materials. Proceedings., 3rd International Symposium on
Conference_Location
Braselton, GA
Print_ISBN
0-7803-3818-9
Type
conf
DOI
10.1109/ISAPM.1997.581250
Filename
581250
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