Title :
Advanced encapsulant systems for flip chip
Author :
Gamota, Daniel ; Melton, Cindy
Author_Institution :
Corporate Manuf. Res. Center, Schaumburg, IL, USA
Abstract :
Flip chip on board (FCOB) technology is a novel electronic assembly structure whereby a bare integrated circuit (IC) die is interconnected directly to an organic printed circuit board (PCB). Mechanical coupling of the die and PCB by an epoxy encapsulant enhances the performance of the FCOB assembly during reliability testing. Advanced encapsulant materials for FCOB must address the issues observed during assembly of consumer electronic products on a high volume manufacturing line. The development of these materials is critical to continue the integration of FCOB assemblies as an alternative packaging system in electronic products. Materials characterization studies were performed to determine the glass transition temperatures (Tg), tensile elastic and loss moduli (E\´ and E"), flow profiles, coefficients of thermal expansion (CTE), and apparent strengths of adhesion for several advanced encapsulants. In addition, reliability tests were conducted to observe the relationship between encapsulant materials properties and reliability responses
Keywords :
adhesion; elastic moduli; encapsulation; flip-chip devices; glass transition; polymers; thermal expansion; FCOB technology; adhesion strength; coefficient of thermal expansion; consumer electronic product; electronic assembly; epoxy encapsulant; flip chip on board; flow profile; glass transition temperature; high volume manufacturing; integrated circuit die; mechanical coupling; organic printed circuit board; packaging; reliability; tensile elastic modulus; tensile loss modulus; Assembly; Circuit testing; Coupling circuits; Electronic packaging thermal management; Flip chip; Integrated circuit interconnections; Integrated circuit reliability; Integrated circuit technology; Materials reliability; Printed circuits;
Conference_Titel :
Advanced Packaging Materials. Proceedings., 3rd International Symposium on
Conference_Location :
Braselton, GA
Print_ISBN :
0-7803-3818-9
DOI :
10.1109/ISAPM.1997.581252
