Advanced encapsulant systems for flip chip

Author

Gamota, Daniel ; Melton, Cindy

Author_Institution

Corporate Manuf. Res. Center, Schaumburg, IL, USA

fYear

1997

fDate

9-12 Mar 1997

Firstpage

46

Lastpage

49

Abstract

Flip chip on board (FCOB) technology is a novel electronic assembly structure whereby a bare integrated circuit (IC) die is interconnected directly to an organic printed circuit board (PCB). Mechanical coupling of the die and PCB by an epoxy encapsulant enhances the performance of the FCOB assembly during reliability testing. Advanced encapsulant materials for FCOB must address the issues observed during assembly of consumer electronic products on a high volume manufacturing line. The development of these materials is critical to continue the integration of FCOB assemblies as an alternative packaging system in electronic products. Materials characterization studies were performed to determine the glass transition temperatures (Tg), tensile elastic and loss moduli (E\´ and E"), flow profiles, coefficients of thermal expansion (CTE), and apparent strengths of adhesion for several advanced encapsulants. In addition, reliability tests were conducted to observe the relationship between encapsulant materials properties and reliability responses

Keywords

adhesion; elastic moduli; encapsulation; flip-chip devices; glass transition; polymers; thermal expansion; FCOB technology; adhesion strength; coefficient of thermal expansion; consumer electronic product; electronic assembly; epoxy encapsulant; flip chip on board; flow profile; glass transition temperature; high volume manufacturing; integrated circuit die; mechanical coupling; organic printed circuit board; packaging; reliability; tensile elastic modulus; tensile loss modulus; Assembly; Circuit testing; Coupling circuits; Electronic packaging thermal management; Flip chip; Integrated circuit interconnections; Integrated circuit reliability; Integrated circuit technology; Materials reliability; Printed circuits;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Packaging Materials. Proceedings., 3rd International Symposium on

Conference_Location

Braselton, GA

Print_ISBN

0-7803-3818-9

Type

conf

DOI

10.1109/ISAPM.1997.581252

Filename

581252