DocumentCode :
3418251
Title :
A screen printable silicone-imide paste for high performance coatings and adhesives
Author :
Choi, Jin-O ; Kirsten, Rudy ; Rojstaczer, Sergio ; Riordan, Daniel
Author_Institution :
Occidental Chem. Co., Grand Island, NY, USA
fYear :
1997
fDate :
9-12 Mar 1997
Firstpage :
56
Abstract :
Summary form only given. A novel screen printable paste has been developed for use as a patterned protective coating or adhesive. This high purity, high solid content paste is based on a high temperature, thermoplastic silicone-imide resin that provides good thermal stability, low water absorption and hot-melt adhesion. By using either a stencil or a screen, a good resolution pattern can be obtained for a 60 μm thick baked layer. The fully cured coatings show low moisture absorption and excellent mechanical properties. The glass transition temperature is 165°C. The fully cured coatings can be bonded to alloy 42 metal substrate by laminating at 250°C. The paste can be used in non-conductive die-attach applications as well as an overcoat protective layer over rigid or flexible circuits
Keywords :
adhesion; printing; protective coatings; silicones; adhesive; alloy 42 metal substrate; baking; bonding; curing; glass transition temperature; hot-melt adhesion; lamination; mechanical properties; moisture absorption; nonconductive die attach; protective coating; screen printing; silicone-imide paste; thermal stability; thermoplastic resin; Absorption; Adhesives; Coatings; Mechanical factors; Moisture; Protection; Resins; Solids; Temperature; Thermal stability;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Packaging Materials. Proceedings., 3rd International Symposium on
Conference_Location :
Braselton, GA
Print_ISBN :
0-7803-3818-9
Type :
conf
DOI :
10.1109/ISAPM.1997.581255
Filename :
581255
Link To Document :
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