A Parallel Electromagnetic Simulation Approach for the Signal Integrity Analysis of IC Packages

Author

Gjonaj, Erion ; Weiland, Thomas ; Munteanu, Irina ; Thoma, Peter

Author_Institution

Tech. Univ. Darmstadt, Darmstadt

fYear

2007

fDate

9-13 July 2007

Firstpage

1

Lastpage

5

Abstract

A full-wave electromagnetic field simulation based on massive parallelization is proposed as a tool for the signal integrity analysis of complex IC packages. The simulations are based on a specialized domain partitioning method which allows for highly balanced parallel computations. As a real-world example the analysis of a large computer chip spreader is performed Numerical results including signal wave forms and delay times are given.

Keywords

delays; electrical engineering computing; integrated circuit packaging; IC packages; balanced parallel computations; computer chip spreader; delay times; full-wave electromagnetic field simulation; massive parallelization; parallel electromagnetic simulation; signal integrity analysis; signal wave forms; specialized domain partitioning; Analytical models; Circuit simulation; Computational modeling; Computer simulation; Electromagnetic analysis; Frequency; Integrated circuit packaging; Propagation delay; Signal analysis; Solid modeling;

fLanguage

English

Publisher

ieee

Conference_Titel

Electromagnetic Compatibility, 2007. EMC 2007. IEEE International Symposium on

Conference_Location

Honolulu, HI

Print_ISBN

1-4244-1349-4

Electronic_ISBN

1-4244-1350-8

Type

conf

DOI

10.1109/ISEMC.2007.193

Filename

4305773