Title :
Plasma inducted wafer arcing in back-end process and the impact on reliability
Author :
Po Li ; Jing-Wei Peng ; Yung-Cheng Wang ; Zhang, David Wei
Author_Institution :
Dept. of Microelectron., Fudan Univ., Shanghai, China
fDate :
Oct. 29 2012-Nov. 1 2012
Abstract :
Wafer arcing is a commonly existed phenomenon, leading to wafer yield loss and reliability failure. By removing contact process, we found arcing frequency increase sharply and behave repeatedly; furthermore, we found seal ring of chip would cause wafer edge metal stressed and had reliability problem for the first time. Subsequently, the methods to reduce the arcing frequency and improve reliability were then studied.
Keywords :
MOSFET; arcs (electric); electrical contacts; plasma materials processing; semiconductor device reliability; MOSFET; arcing frequency; back-end process; chip; contact process; plasma inducted wafer arcing; reliability failure; seal ring; wafer edge metal stress; wafer yield loss; Metals; Plasmas; Seals; Semiconductor device reliability; Substrates;
Conference_Titel :
Solid-State and Integrated Circuit Technology (ICSICT), 2012 IEEE 11th International Conference on
Conference_Location :
Xi´an
Print_ISBN :
978-1-4673-2474-8
DOI :
10.1109/ICSICT.2012.6467758
