Title :
Microwave characterization of thin film materials for interconnections of advanced packaging
Author :
Flechet, B. ; Salik, R. ; Tao, J.W. ; Angénieux, G.
Author_Institution :
Silvaco Int., Santa Clara, CA, USA
Abstract :
Low permittivity insulator layers made of new organic or inorganic materials, associated to conductive layers, with thickness less than one micrometer are used more and more to develop interconnections of microwave or high speed circuits, and electronic packaging. Such thin film microstrip lines have been modeled between 1 GHz and 40 GHz using a rigorous full-wave method based on a modified transverse resonance technique. Comparison between theoretical and experimental propagation constants enables us to extract the in-situ complex permittivity of insulators and the electrical conductivity of conductors by an iterative optimization technique
Keywords :
electrical conductivity measurement; insulating thin films; iterative methods; microstrip lines; microwave measurement; packaging; permittivity measurement; transmission line theory; 1 to 40 GHz; advanced packaging; electrical conductivity; electronic packaging; high speed circuits; in-situ complex permittivity; interconnections; iterative optimization technique; low permittivity insulator layers; microwave characterization; modified transverse resonance technique; propagation constants; rigorous full-wave method; thin film materials; thin film microstrip lines; Conducting materials; Conductive films; Electronics packaging; Inorganic materials; Insulation; Integrated circuit interconnections; Microwave circuits; Permittivity; Thin film circuits; Transistors;
Conference_Titel :
Advanced Packaging Materials. Proceedings., 3rd International Symposium on
Conference_Location :
Braselton, GA
Print_ISBN :
0-7803-3818-9
DOI :
10.1109/ISAPM.1997.581278
