• DocumentCode
    3418742
  • Title

    Electrical performance in time domain of subminiature interconnections on new thin films

  • Author

    Salik, R. ; Ferrari, P. ; Chosson, A. ; Angnieux, G.

  • Author_Institution
    Silvaco Int., Santa Clara, CA, USA
  • fYear
    1997
  • fDate
    9-12 Mar 1997
  • Firstpage
    143
  • Lastpage
    146
  • Abstract
    This paper is focused on transmission lines with dimensions comparable to future VLSI interconnections (except for the transmission line width which is equal to 5 μm, whereas the width of future interconnections will probably be less than 1 μm). The goal is to show on which characteristic the effort must be made. To achieve this, the propagation of fast signals along the transmission lines is studied in the time domain. The effect of the insulator on electrical delay and distortion are pointed out. A Fourier transform is used to give the propagation constant γ(ω)=α(ω)+jβ(ω) of the transmission lines in the frequency domain. Results are compared to those obtained by a full wave frequency domain modeling method (TRM)
  • Keywords
    VLSI; delays; frequency-domain analysis; integrated circuit interconnections; integrated circuit measurement; microwave measurement; time-domain analysis; Fourier transform; SiOF organic oxide; VLSI interconnections; distortion; electrical delay; fast signal propagation; full wave frequency domain modeling method; insulator effect; propagation constant; subminiature interconnections; thin films; time domain electrical performance; transmission lines; Delay effects; Dielectrics and electrical insulation; Frequency domain analysis; Integrated circuit interconnections; Length measurement; Time measurement; Transistors; Transmission line measurements; Transmission line theory; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Packaging Materials. Proceedings., 3rd International Symposium on
  • Conference_Location
    Braselton, GA
  • Print_ISBN
    0-7803-3818-9
  • Type

    conf

  • DOI
    10.1109/ISAPM.1997.581279
  • Filename
    581279