Title :
Imp act of MCM technology on high speed transient waveforms
Author :
Wenzel, Robert J. ; Keezer, David C.
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
The impact of MCM technology material system properties on high speed logic transient waveshapes is examined. The analyses utilize a custom FFT-based transient simulation approach. The frequency-dependent complex propagation constant and line characteristic impedance in the presence of arbitrary losses are derived from the dispersion-corrected effective permittivity, impedance, conductor and dielectric losses for the particular transmission line and material properties under consideration. Conductor AC skin effect, and substrate ohmic loss due to finite conductivity are considered as well as the conductor bulk DC resistance and dielectric loss tangent (frictional dipole damping). Examples assume an ideal microstrip geometry in approximation to actual MCM surface line structures. The pulse performance is predicted for isolated discontinuity-free straight lines without nearby lines, vias, pins or package metallization in order to assess material property-related effects
Keywords :
dielectric losses; electric impedance; fast Fourier transforms; logic circuits; microstrip lines; multichip modules; permittivity; skin effect; time-frequency analysis; transient analysis; transmission line theory; waveform analysis; MCM surface line structures; MCM technology material system properties; arbitrary losses; conductor AC skin effect; conductor bulk DC resistance; conductor losses; custom FFT-based transient simulation approach; dielectric loss tangent; dielectric losses; dispersion-corrected effective permittivity; frequency-dependent complex propagation constant; frictional dipole damping; high speed logic transient waveshapes; ideal microstrip geometry; impedance; isolated discontinuity-free straight lines; line characteristic impedance; pulse performance; substrate ohmic loss; transmission line; Analytical models; Conducting materials; Dielectric losses; Dielectric materials; Dielectric substrates; Impedance; Logic; Power system transients; Propagation losses; Transient analysis;
Conference_Titel :
Advanced Packaging Materials. Proceedings., 3rd International Symposium on
Conference_Location :
Braselton, GA
Print_ISBN :
0-7803-3818-9
DOI :
10.1109/ISAPM.1997.581281