Al/SiC for power electronics packaging

Author

Premkumar, M.K.

Author_Institution

Alcoa Composite Components, Alcoa Center, PA, USA

fYear

1997

fDate

9-12 Mar 1997

Firstpage

162

Lastpage

165

Abstract

Al/SiC composites have a CTE that very closely matches ceramics along with a high thermal conductivity. In addition, these composites also have an elastic modulus that is 2× that of Cu and a density that is 66% less than that of Cu. These properties allow for a package design that is significantly superior to the traditional Cu baseplate design. This presentation discusses the unique properties of Al/SiC as it applies to power electronics packaging. The results of thermal cycling and other reliability testing of Al/SiC products are presented and discussed

Keywords

aluminium; elastic moduli; integrated circuit packaging; integrated circuit reliability; particle reinforced composites; power integrated circuits; silicon compounds; thermal conductivity; thermal expansion; Al-SiC; CTE; elastic modulus; package design; power electronics packaging; reliability testing; thermal conductivity; thermal cycling; Ceramics; Composite materials; Conducting materials; Electronic packaging thermal management; Electronics packaging; Mechanical factors; Preforms; Silicon carbide; Thermal conductivity; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Packaging Materials. Proceedings., 3rd International Symposium on

Conference_Location

Braselton, GA

Print_ISBN

0-7803-3818-9

Type

conf

DOI

10.1109/ISAPM.1997.581284

Filename

581284