Title :
Al/SiC for power electronics packaging
Author_Institution :
Alcoa Composite Components, Alcoa Center, PA, USA
Abstract :
Al/SiC composites have a CTE that very closely matches ceramics along with a high thermal conductivity. In addition, these composites also have an elastic modulus that is 2× that of Cu and a density that is 66% less than that of Cu. These properties allow for a package design that is significantly superior to the traditional Cu baseplate design. This presentation discusses the unique properties of Al/SiC as it applies to power electronics packaging. The results of thermal cycling and other reliability testing of Al/SiC products are presented and discussed
Keywords :
aluminium; elastic moduli; integrated circuit packaging; integrated circuit reliability; particle reinforced composites; power integrated circuits; silicon compounds; thermal conductivity; thermal expansion; Al-SiC; CTE; elastic modulus; package design; power electronics packaging; reliability testing; thermal conductivity; thermal cycling; Ceramics; Composite materials; Conducting materials; Electronic packaging thermal management; Electronics packaging; Mechanical factors; Preforms; Silicon carbide; Thermal conductivity; Thermal resistance;
Conference_Titel :
Advanced Packaging Materials. Proceedings., 3rd International Symposium on
Conference_Location :
Braselton, GA
Print_ISBN :
0-7803-3818-9
DOI :
10.1109/ISAPM.1997.581284
