Analysis and design of MEMS and embedded components in silicon/LTCC packages using FDTD/MRTD for system-on-package applications (SOP)

Author

Tentzeris, M. ; Bushyager, N. ; Laskar, J. ; Zheng, G. ; Papapolymerou, J.

Author_Institution

Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

fYear

2003

fDate

11-11 April 2003

Firstpage

138

Lastpage

141

Abstract

The FDTD and MRTD full-wave numerical techniques are applied to the modeling and analysis of embedded components, such as MEMS, in silicon packages. Preliminary design rules are derived for minimized-crosstalk transmission lines, for a wideband compact transition, for a MEMS switch and that can be used in practical tuning applications and for a packaging adaptive antenna.

Keywords

S-parameters; adaptive antenna arrays; ceramic packaging; coplanar waveguides; crosstalk; finite difference time-domain analysis; integrated circuit packaging; micromechanical devices; microstrip lines; microswitches; microwave switches; multichip modules; time-domain analysis; FDTD method; LTCC packages; MEMS capacitive switch; MEMS components; MRTD subcell method; SOP applications; Si packages; adaptive antenna packaging; design rules; embedded components; full-wave numerical techniques; minimized-crosstalk transmission lines; modeling; multiresolution time-domain method; system-on-package applications; tuning applications; wideband compact transition; Adaptive arrays; Broadband antennas; Electronics packaging; Finite difference methods; Frequency; Micromechanical devices; Silicon; Time domain analysis; Transceivers; Transmission line antennas;

fLanguage

English

Publisher

ieee

Conference_Titel

Silicon Monolithic Integrated Circuits in RF Systems, 2003. Digest of Papers. 2003 Topical Meeting on

Conference_Location

Grainau, Germany

Print_ISBN

0-7803-7787-7

Type

conf

DOI

10.1109/SMIC.2003.1196689

Filename

1196689