• DocumentCode
    3419268
  • Title

    EM design of an isolated coplanar RE cross for MEMS switch matrix applications

  • Author

    Simon, W. ; Lauer, A. ; Schauwecker, B. ; Wien, A.

  • Author_Institution
    IMST GmbH, Kamp Lintfort, Germany
  • fYear
    2003
  • fDate
    11-11 April 2003
  • Firstpage
    162
  • Lastpage
    165
  • Abstract
    The EM design of a coplanar RF cross with well isolated signal paths in a frequency range from DC up to 40 GHz is described. The cross is designed for a MEMS switch matrix where the different signal paths have to be isolated against each other. This allows one to have several ´on-state´ signal paths at the same time in the matrix. One signal path is routed via an underpath metallisation while the other signal path is routed with an air bridge. A metal sheet connecting both coplanar ground metallisations is used as a shield to achieve good isolation. The optimisation of all elements from the cross is done with a full wave FDTD simulator. The achieved isolation between the two signal paths of the coplanar RF cross is above 40 dB up to 40 GHz. For both signal paths is in measurement and simulation for frequencies up to 20 GHz the return loss better than 18 dB and the insertion loss is below 0.7 dB.
  • Keywords
    coplanar waveguide components; electromagnetic shielding; metallisation; microswitches; microwave switches; 0 to 40 GHz; 0.7 dB; 18 dB; CPW; EM design; MEMS switch matrix applications; air bridge; coplanar ground metallisations; full wave FDTD simulator; isolated coplanar RE cross; isolated signal paths; shield; underpath metallisation; Bridge circuits; Finite difference methods; Joining processes; Metallization; Microswitches; RF signals; Radio frequency; Signal design; Time domain analysis; Transmission line matrix methods;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Silicon Monolithic Integrated Circuits in RF Systems, 2003. Digest of Papers. 2003 Topical Meeting on
  • Conference_Location
    Grainau, Germany
  • Print_ISBN
    0-7803-7787-7
  • Type

    conf

  • DOI
    10.1109/SMIC.2003.1196695
  • Filename
    1196695