Title :
Thermally stabilized flip-chip mounted monolithic oscillators using CPW technology
Author :
Hirose, T. ; Tomioka, T. ; Yokokawa, S. ; Shimura, T. ; Watanabe, Y.
Author_Institution :
Fujitsu Labs. Ltd., Kawasaki, Japan
Abstract :
We have designed and fabricated a flip-chip mounted Ka-band monolithic oscillator using 0.15 /spl mu/m gate InGaP-InGaAs HEMT device and incorporating CPW technology. We obtained a thermal stability of 1.8 ppm//spl deg/C for the oscillation frequency. An asymmetric source feedback circuit topology was employed in order to optimize the feedback circuit and minimize chip area. We also demonstrate the thermal stability analysis to evaluate the contributions of the flip-chip micro-pillar thermal resistance.
Keywords :
HEMT integrated circuits; MMIC oscillators; circuit stability; coplanar waveguide components; feedback oscillators; field effect MIMIC; flip-chip devices; integrated circuit design; integrated circuit packaging; millimetre wave oscillators; thermal analysis; thermal management (packaging); thermal stability; 0.15 micron; 20 to 100 C; 37 to 39 GHz; CPW technology; EHF; HEMT device; InGaP-InGaAs; Ka-band; MM-wave IC; asymmetric source feedback circuit topology; flip-chip micro-pillar thermal resistance; flip-chip mounted monolithic oscillators; oscillation frequency; thermal stability analysis; thermally stabilized oscillators; Circuit stability; Circuit topology; Coplanar waveguides; Feedback circuits; Frequency; HEMTs; Oscillators; Stability analysis; Thermal resistance; Thermal stability;
Conference_Titel :
Microwave Symposium Digest, 1999 IEEE MTT-S International
Conference_Location :
Anaheim, CA, USA
Print_ISBN :
0-7803-5135-5
DOI :
10.1109/MWSYM.1999.779433
