DocumentCode :
3419529
Title :
A modified ESD clamp circuit for 90-nm CMOS process
Author :
Hong-Xia Liu ; Zhao-Nian Yang ; Yi Luo ; Chen Liu
Author_Institution :
Key Lab. of Minist. of Educ. for Wide Band-Gap Semicond. Mater. & Devices, Xidian Univ., Xi´an, China
fYear :
2012
fDate :
Oct. 29 2012-Nov. 1 2012
Firstpage :
1
Lastpage :
4
Abstract :
In nanoscale CMOS process, integrated circuits (ICs) face serious gate reliability issues such as the damage of electrostatic discharge (ESD). The RC-triggered silicon-controlled rectifier (SCR) is widely studied for the high turn-on efficiency and discharge capability. However, the large gate leakage current of MOS capacitor in the traditional RC network in nanoscale process is not desired. In this work, a modified detection circuit with feedback technique is proposed. The leakage current is reduced to 16 nA at room temperature (25 °C). Under the ESD event, it injects 38 mA trigger current into the p-substrate of SCR. Compared with the previous circuits, the proposed circuit can save area and power consumption while achieving the same performance. The simulation result shows that this clamp circuit can be used in industry.
Keywords :
CMOS integrated circuits; MOS capacitors; circuit feedback; electrostatic discharge; integrated circuit reliability; leakage currents; thyristors; MOS capacitor; RC network; RC-triggered silicon-controlled rectifier; SCR; area consumption; current 16 nA; current 38 mA; discharge capability; electrostatic discharge; feedback technique; gate leakage current; gate reliability issues; high turn-on efficiency; modified ESD clamp circuit; modified detection circuit; nanoscale CMOS process; p-substrate; power consumption; size 90 nm; temperature 25 degC; temperature 293 K to 298 K; CMOS process; Capacitors; Clamps; Digital audio players; Electrostatic discharges; Leakage current; Logic gates;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State and Integrated Circuit Technology (ICSICT), 2012 IEEE 11th International Conference on
Conference_Location :
Xi´an
Print_ISBN :
978-1-4673-2474-8
Type :
conf
DOI :
10.1109/ICSICT.2012.6467804
Filename :
6467804
Link To Document :
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